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Home Semiconductor packaging accessories Au-Sn Lid
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Au-Sn Lid

Au-Sn Lid

Chuangxin
Size can be cusomized
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$0.00
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Description

AUSN8020 frame;
4J42/4J29 gold plated lid;
Helium Leak Rate≤5*10-9pa*M3/S；
Offset between frame and lid is less than 0.05mm;
No overflow at joint;
Excellent melting;
Less than 15% cavity with no penetrating holes

Au-Sn Lid
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