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Minimun pin pitch:0.5mm;
Chip size:0.45*0.45~20*20mm(thinckness≥0.15mm）;
Minimum pad size:60μm;
Minimum pad pitch:70μm；
Minimum die to edge:0.25mm(no wire on substrate);
Die attachment:solder/conductive adhesive/insulating adhesive/silver sintering;
Bonding with 20~50μmgold wire or Al-Si 25~150μm wire;
Support multi-layer bonding;
Wire loop height≥0.1mm
